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STM8L101F1P3ATR Fiches technique(PDF) 69 Page - STMicroelectronics |
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STM8L101F1P3ATR Fiches technique(HTML) 69 Page - STMicroelectronics |
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69 / 81 page ![]() STM8L101xx Package characteristics Doc ID 15275 Rev 11 69/81 Figure 39. LQFP32 - 32-pin low profile quad flat package outline (7 x 7)(1) Figure 40. LQFP32 recommended footprint(1)(2) 1. Drawing is not to scale. 2. Dimensions are in millimeters. Table 40. LQFP32- 32-pin low profile quad flat package (7x7), package mechanical data Dim. mm inches(1) Min Typ Max Min Typ Max A1.6 0.063 A1 0.05 0.15 0.002 0.0059 A2 1.35 1.4 1.45 0.0531 0.0551 0.0571 b 0.3 0.37 0.45 0.0118 0.0146 0.0177 c 0.09 0.2 0.0035 0.0079 D 8.8 9 9.2 0.3465 0.3543 0.3622 D1 6.8 7 7.2 0.2677 0.2756 0.2835 D3 5.6 0.2205 E 8.8 9 9.2 0.3465 0.3543 0.3622 E1 6.8 7 7.2 0.2677 0.2756 0.2835 E3 5.6 0.2205 e 0.8 0.0315 L 0.45 0.6 0.75 0.0177 0.0236 0.0295 L1 1 0.0394 K 0.0° 3.5° 7.0° 0.0° 3.5° 7.0° ccc 0.1 0.0039 Number of pins N32 1. Values in inches are converted from mm and rounded to 4 decimal digits. Seating plane C AA2 A1 b c A1 L L1 0.25 mm Gage plane K D D1 D3 24 17 16 25 E3 E1 E 9 32 18 Pin 1 identification e 5V_ME ccc C 5V_FT 32 1 8 9 25 24 17 16 |
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