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MNSC140CORE Fiches technique(PDF) 71 Page - Freescale Semiconductor, Inc |
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MNSC140CORE Fiches technique(HTML) 71 Page - Freescale Semiconductor, Inc |
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71 / 80 page ![]() FC-CBGA (HCTE) Package Mechanical Drawing MSC8102 Quad Core Digital Signal Processor, Rev. 12 Freescale Semiconductor 3-19 3.2 FC-CBGA (HCTE) Package Mechanical Drawing Figure 3-3. MSC8102 Mechanical Information, 431-pin FC-CBGA (HCTE) Package CASE 1453-02 Notes: 1. All dimensions in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M–1994. 3. Maximum solder ball diameter measured parallel to Datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. |
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