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C5NPD0-DS Fiches technique(PDF) 93 Page - Freescale Semiconductor, Inc |
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C5NPD0-DS Fiches technique(HTML) 93 Page - Freescale Semiconductor, Inc |
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93 / 100 page ![]() Marking Codes 95 V 04 Marking Codes Table 58 explains the marking on the C-5 NP. Reflow Typical Reflow Profile for the C-5 Switch Module 1 Follow the guidelines recommended by your solder paste supplier. Flux requrements must be met for best solderability. 2 The temperature profile should be carefully characterized to ensure uniform temperature across the board and package. Solder ball voiding may be affected by ramp rates and dwell times below and above liquidus. Table 57 Package Measurements (Reference Figure 26 and Figure 27 for Symbols) SYMBOL DEFINITION NOM. (MM) MIN. (MM) MAX. (MM) A Overall 5.63 5.31 5.95 A 1 Ball height 0.89 A 2 C4 and Die 0.88 A 3 Body thickness 2.26 2.07 2.53 A 4 Lid thickness 1.6 D Body size 37.50 D 1 Ball footprint (X) 35.56 E Body size 37.50 E 1 Ball footprint (Y) 35.56 e Ball pitch 1.27 b Ball diameter 0.89 Table 58 C-5 Network Processor Marking Codes MARKING (EXPLANATION OF CODES) Top Logo/Part#/Country of Origin/Date Code Bottom N/A Pin 1 Marking Chamfered Corner Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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