C5NPD0-DS datasheet(72/100 Pages) FREESCALE

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CHAPTER 3: ELECTRICAL SPECIFICATIONS

C5NP

– Dimensions: 100mm x 80mm x 10mm (height)

– Thermal resistance heat sink to ambient (

SA) of 1.6

oC/W @200 LFM. Figure 10

provides the characteristic thermal resistance curve for this heat sink for various

airflow rates.

– Thermal resistance case to heat sink (

CS) of 0.03

oC/W (Chromerics T705

thermal material).

– Note that target heat sink design is for low profile (10mm height) applications.

Significantly better thermal performance is possible with taller and/or wider

designs. Contact your C-Port representative for heat sink options.

3 Effective Thermal Resistance (

effective = φJAφJBA / (φJA + φJBA)) reflects the total thermal

performance of the heat sink and board, as outlined in Note 2 above.

Figure 10 Thermal Performance for C-5 Network Processor Heat Sink (see step 2 above)

AC Timing Specifications

AC timing specifications consist of input requirements and output responses. The input

requirements include setup and hold times, pulse widths, and high and low times. The

output responses include delays from clock to signal. The AC timing specifications are

defined separately for each interface to the C-5 NP

Unless otherwise noted, all AC specifications were tested within the functional operating

range.

200

400

600

800

1000

Velocity (ft/min)

Theoretical calculation of thermal resistance as a function of airflow velocity across heat sink

Freescale Semiconductor, Inc.

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C5NPD0-DS Fiches technique(PDF) 72 Page - Freescale Semiconductor, Inc