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DS8113-RNG+ Fiches technique(PDF) 3 Page - Maxim Integrated Products |
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DS8113-RNG+ Fiches technique(HTML) 3 Page - Maxim Integrated Products |
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3 / 17 page ![]() Smart Card Interface _______________________________________________________________________________________ 3 RECOMMENDED DC OPERATING CONDITIONS (continued) (VDD = +3.3V, VDDA = +5.0V, TA = +25°C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS CLOCK SOURCE Crystal Frequency fXTAL External crystal 0 20 MHz fXTAL1 0 20 MHz VIL_XTAL1 Low-level input on XTAL1 -0.3 0.3 x VDD XTAL1 Operating Conditions VIH_XTAL1 High-level input on XTAL1 0.7 x VDD VDD + 0.3 V External Capacitance for Crystal CXTAL1, CXTAL2 15 pF Internal Oscillator fINT 2.7 MHz SHUTDOWN TEMPERATURE Shutdown Temperature TSD +150 °C RST PIN Output Low Voltage VOL_RST1 IOL_RST = 1mA 0 0.3 V Card-Inactive Mode Output Current IOL_RST1 VO_LRST = 0V 0 -1 mA Output Low Voltage VOL_RST2 IOL_RST = 200μA 0 0.3 V Output High Voltage VOH_RST2 IOH_RST = -200μA VCC - 0.5 VCC V Rise Time tR_RST CL = 30pF 0.1 μs Fall Time tF_RST CL = 30pF 0.1 μs Shutdown Current Threshold IRST(SD) -20 mA Current Limitation IRST(LIMIT) -20 +20 mA Card-Active Mode RSTIN to RST Delay tD(RSTIN-RST) 2 μs CLK PIN Output Low Voltage VOL_CLK1 IOLCLK = 1mA 0 0.3 V Card-Inactive Mode Output Current IOL_CLK1 VOLCLK = 0V 0 -1 mA Output Low Voltage VOL_CLK2 IOLCLK = 200μA 0 0.3 V Output High Voltage VOH_CLK2 IOHCLK = -200μA VCC - 0.5 VCC V Rise Time tR_CLK CL = 30pF (Note 4) 8 ns Fall Time tF_CLK CL = 30pF (Note 4) 8 ns Current Limitation ICLK(LIMIT) -70 +70 mA Clock Frequency fCLK Operational 0 10 MHz Duty Factor CL = 30pF 45 55 % Card-Active Mode Slew Rate SR CL = 30pF 0.2 V/ns VCC PIN Output Low Voltage VCC1 ICC = 1mA 0 0.3 V Card-Inactive Mode Output Current ICC1 VCC = 0V 0 -1 mA |
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