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MCP6031-E/MS Fiches technique(PDF) 19 Page - Microchip Technology |
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MCP6031-E/MS Fiches technique(HTML) 19 Page - Microchip Technology |
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19 / 34 page ![]() © 2008 Microchip Technology Inc. DS22041B-page 19 MCP6031/2/3/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead MSOP Example: XXXXXX YWWNNN 6031E 809256 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN MCP6033E SN^^0809 256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 5-Lead SOT-23 ( MCP6031) Example: XXNN EA25 Device E-Temp Code MCP6031T-E/OT EANN Example: ABV 809 25 8-Lead 2x3 DFN (MCP6031 & MCP6033) XXX YWW NN |
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