LT3011

15

3011f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

3.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION

OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS

OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65 ± 0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

2.38 ±0.10

(2 SIDES)

1

5

10

6

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DD) DFN 1103

0.25 ± 0.05

2.38 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65 ±0.05

(2 SIDES)

2.15 ±0.05

0.50

BSC

0.675 ±0.05

3.50 ±0.05

PACKAGE

OUTLINE

0.25 ± 0.05

0.50 BSC

MSE Package

12-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1666 Rev B)

DD Package

10-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1699)

MSOP (MSE12) 0608 REV B

0.53

0.152

(.021

.006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.86

(.034)

REF

0.650

(.0256)

BSC

12

12 11 10 9 8 7

7

DETAIL “B”

1

6

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0 – 6 TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

RECOMMENDED SOLDER PAD LAYOUT

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.845

0.102

(.112

.004)

2.845

0.102

(.112

.004)

4.039

0.102

(.159

.004)

(NOTE 3)

1.651

0.102

(.065

.004)

0.1016

0.0508

(.004

.002)

12 3 4 5 6

3.00

0.102

(.118

.004)

(NOTE 4)

0.406

0.076

(.016

.003)

REF

4.90

0.152

(.193

.006)

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.12 REF

0.35

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

0.127

(.035

.005)

0.42

0.038

(.0165

.0015)

TYP

0.65

(.0256)

BSC