L6756D datasheet(34/36 Pages) STMICROELECTRONICS

No de pièce	L6756D

Description	2/3/4 phase buck controller for VR10, VR11 and VR11.1 processor applications

PDF	36 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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34 / 36 page

Mechanical data and package dimensions

L6756D

34/36

Mechanical data and package dimensions

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 17.

Mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

0.800

0.900

1.000

0.031

0.035

0.039

0.020

0.050

0.0008 0.0019

0.180

0.250

0.300

0.007

0.009

0.012

5.900

6.000

6.100

0.232

0.236

0.240

3.950

4.100

4.200

0.155

0.161

0.165

5.900

6.000

6.100

0.232

0.236

0.240

3.950

4.100

4.200

0.155

0.161

0.165

0.500

0.020

0.300

0.400

0.500

0.012

0.015

0.018

ddd

0.080

0.003

VFQFPN-40 (6x6x1.0mm)

Very Fine Quad Flat Package No lead

ddd

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