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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STPCELITE Fiches technique(PDF) 56 Page - STMicroelectronics |
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STPCELITE Fiches technique(HTML) 56 Page - STMicroelectronics |
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56 / 87 page  MECHANICAL DATA 56/87 Release 1.3 - January 29, 2002 5.2. 388-PIN PACKAGE THERMAL DATA The 388-pin PBGA package has a Power Dissipation Capability of 4.5W. This increases to 6W when used with a Heatsink. The structure in shown in Figure 5-4. Thermal dissipation options are illustrated in Figure 5-5 and Figure 5-6. Figure 5-4. 388-Pin PBGA structure Thermal balls Power & Ground layers Signal layers Figure 5-5. Thermal Dissipation Without Heatsink Ambient Board Case Junction Board Ambient Ambient Case Junction Board Rca Rjc Rjb Rba 66 125 8.5 Rja = 13 °C/W Airflow = 0 Board dimensions: The PBGA is centred on board Copper thickness: - 17µm for internal layers - 34µm for external layers - 10.2 cm x 12.7 cm - 4 layers (2 for signals, 1 GND, 1VCC) There are no other devices 1 via pad per ground ball (8-mil wire) 40% copper on signal layers Board temperature taken at the centrecentre ba |
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