MPC8309CVMADFC datasheet(52/81 Pages) NXP

No de pièce	MPC8309CVMADFC

Description	PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications

PDF	81 Pages

Scroll/Zoom	100%

Fabricant	NXP [NXP Semiconductors]

Site Internet	http://www.nxp.com

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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3

Freescale Semiconductor

Package and Pin Listings

22 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8309 is available in

a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 22.1, “Package

Parameters for the MPC8309,” and Section 22.2, “Mechanical Dimensions of the MPC8309 MAPBGA,”

for information on the MAPBGA.

22.1

Package Parameters for the MPC8309

The package parameters are as provided in the following list.

Package outline

19 mm

19 mm

Package Type

MAPBGA

Interconnects

489

Pitch

0.80 mm

Module height (typical)

1.48 mm; Min = 1.31mm and Max 1.61mm

Solder Balls

96 Sn / 3.5 Ag / 0.5 Cu (VM package)

Ball diameter (typical)

0.40 mm

22.2

Mechanical Dimensions of the MPC8309 MAPBGA

The following figure shows the mechanical dimensions and bottom surface nomenclature of the

MPC8309, 489-MAPBGA package.

MPC8309CVMADFC Fiches technique(PDF) 52 Page - NXP Semiconductors