ADS5294 datasheet(10/82 Pages) TI2

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ADS5294

SLAS776E – NOVEMBER 2011 – REVISED APRIL 2018

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(1)

See the Large and Small Signal Input Bandwidth section.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

SUPPLIES

AVDD

Analog supply voltage

1.7

1.8

1.9

LVDD

Digital supply voltage

1.7

1.8

1.9

ANALOG INPUTS/OUTPUTS

Differential input voltage range

VPP

Input common-mode voltage

0.95 ± 0.05

REFT

External reference mode

1.45

REFB

External reference mode

0.45

VCM

Common-mode voltage output

0.95

External Reference mode Input

1.5

Maximum Input Frequency (1)

2 VPP amplitude

MHz

CLOCK INPUTS

ADC Clock input sample rate

MSPS

Input Clock amplitude differential

(V(CLKP) – V(CLKN)) peak-to-peak

Sine wave, AC-coupled

0.2

1.5

VPP

LVPECL, AC-coupled

0.2

1.6

LVDS, AC-coupled

0.2

0.7

VIL

Input Clock CMOS single-ended (V(CLKP))

<0.3

VIH

>1.5

Input clock duty cycle

35%

50%

65%

DIGITAL OUTPUTS

ACLKP and ACLKN outputs (LVDS), 1-wire interface

1x (sample rate)

MSPS

LCLKP and LCLKN outputs (LVDS), 1-wire interface

7x (sample rate)

MSPS

ACLKP and ACLKN outputs (LVDS), 2-wire interface

0.5x (sample rate)

MSPS

LCLKP and LCLKN outputs (LVDS), 2-wire interface

3.5x (sample rate)

MSPS

Maximum data rate, 2-wire interface

560

Mbps

Maximum data rate, 1-wire interface

700

Mbps

CLOAD Maximum external capacitance from each output pin to LGND

RLOAD Differential load resistance between the LVDS output pairs

100

Operating free-air temperature

–40

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

8.4 Thermal Information

THERMAL METRIC(1)

ADS5294

UNIT

PFP (HTQFP)

80 PINS

RθJA

Junction-to-ambient thermal resistance

30.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

6.3

°C/W

RθJB

Junction-to-board thermal resistance

8.3

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

8.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.3

°C/W

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