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STM32L412C8I6TR Fiches technique(PDF) 178 Page - STMicroelectronics |
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STM32L412C8I6TR Fiches technique(HTML) 178 Page - STMicroelectronics |
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178 / 192 page ![]() Package information STM32L412xx 178/192 DS12469 Rev 4 Table 99. WLCSP - 36 balls, 2.58 x 3.07 mm, 0.4 mm pitch, wafer level chip scale mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A(2) 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3(3) 3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process capability. - 0.025 - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 2.55 2.58 2.61 0.100 0.102 0.103 E 3.04 3.07 3.10 0.120 0.121 0.122 e - 0.40 - - 0.016 - e1 - 2.00 - - 0.079 - e2 - 2.00 - - 0.079 - F(4) 4. Calculated dimensions are rounded to the 3rd decimal place - 0.290 - - 0.0114 - G(4) - 0.535 - - 0.0211 - aaa - 0.10 - - 0.004 - bbb - 0.10 - - 0.004 - ccc - 0.10 - - 0.004 - ddd - 0.05 - - 0.002 - eee - 0.05 - - 0.002 - |
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