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VL53L4ED Fiches technique(PDF) 33 Page - STMicroelectronics |
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VL53L4ED Fiches technique(HTML) 33 Page - STMicroelectronics |
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33 / 39 page ![]() Figure 32. Solder profile Note: The component should be limited to a maximum of three passes through this solder profile. Note: As the VL53L4ED package is not sealed, only a dry reflow process should be used (such as convection reflow). Vapor phase reflow is not suitable for this type of optical component. Note: The VL53L4ED is an optical component and as such, it should be treated carefully. This would typically include using a ‘no wash’ assembly process. VL53L4ED Handling, moisture, and reflow precautions DS14256 - Rev 3 page 33/39 |
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