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PCF8812U/2 Fiches technique(PDF) 32 Page - NXP Semiconductors |
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PCF8812U/2 Fiches technique(HTML) 32 Page - NXP Semiconductors |
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32 / 36 page ![]() This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... MGT653 PC8812-1 x y 0, 0 Fig.20 Bonding pad locations. (1) The alignment marks are circular with a diameter of 100 µm. (2) Maximum chip size: 2.1 × 10.9 mm. |
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