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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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CC2500-RTR1 Fiches technique(PDF) 79 Page - Texas Instruments |
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CC2500-RTR1 Fiches technique(HTML) 79 Page - Texas Instruments |
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79 / 84 page  CC2500 PRELIMINARY Data Sheet (Rev.1.2) SWRS040A Page 79 of 83 32.1 Recommended PCB layout for package (QLP 20) Figure 30: Recommended PCB layout for QLP 20 package Note: The figure is an illustration only and not to scale. There are five 10 mil diameter via holes distributed symmetrically in the ground pad under the package. See also the CC2500EM reference design. 32.2 Package thermal properties Thermal resistance Air velocity [m/s] 0 Rth,j-a [K/W] 40.4 Table 39: Thermal properties of QLP 20 package 32.3 Soldering information The recommendations for lead-free reflow in IPC/JEDEC J-STD-020C should be followed. 32.4 Tray specification CC2500 can be delivered in standard QLP 4x4 mm shipping trays. Tray Specification Package Tray Width Tray Height Tray Length Units per Tray QLP 20 135.9 mm 7.62 mm 322.6 mm 490 Table 40: Tray specification |
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