MPC8560CPXAPDB datasheet(89/108 Pages) FREESCALE

89 / 108 page

MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1

Freescale Semiconductor

Thermal

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at

a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several heat sinks offered by

Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer

different heat sink-to-ambient thermal resistances, that will allow the MPC8560 to function in various environments.

16.2.1 Recommended Thermal Model

For system thermal modeling, the MPC8560 thermal model is shown in Figure 52. Five cuboids are used to

represent this device. To simplify the model, the solder balls and substrate are modeled as a single block 29x29x1.47

mm with the conductivity adjusted accordingly. For modeling, the planar dimensions of the die are rounded to the

nearest mm, so the die is modeled as 10x12 mm at a thickness of 0.76 mm. The bump/underfill layer is modeled as

a collapsed resistance between the die and substrate assuming a conductivity of 0.6 in-plane and 1.9 W/m•K in the

thickness dimension of 0.76 mm. The lid attach adhesive is also modeled as a collapsed resistance with dimensions

of 10x12x0.050 mm and the conductivity of 1 W/m•K. The nickel plated copper lid is modeled as 12x14x1 mm.

Note that the die and lid are not centered on the substrate; there is a 1.5 mm offset documented in the case outline

drawing in Figure 50.

Figure 52. MPC8560 Thermal Model

Die

Lid

Substrate and solder balls

Heat Source

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity

Value

Unit

Lid

(12

× 14 × 1 mm)

360

W/(m

× K)

360

Lid Adhesive—Collapsed resistance

(10

× 12 × 0.050 mm)

Die

(10

× 12 × 0.76 mm)

Bump/Underfill—Collapsed resistance

(10

× 12 × 0.070 mm)

0.6

1.9

Substrate and Solder Balls

(29

× 29 × 1.47 mm)

10.2

1.6

Adhesive

Bump/underfill

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