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MPC602EC/D Fiches technique(PDF) 20 Page - NXP Semiconductors |
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MPC602EC/D Fiches technique(HTML) 20 Page - NXP Semiconductors |
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20 / 26 page ![]() 20 PowerPC 602 RISC Microprocessor Hardware Specifications 1.6.2 IBM PQFP Package Description The following sections provide the package parameters and mechanical dimensions for the IBM PQFP package. 1.6.2.1 Package Parameters The package parameters are as provided in the following list. The package type is mm x mm, 144-pin plastic quad flat pack. Package outline 28 mm x 28 mm Interconnects 144 Pitch 0.65 mm Lead plating Ni Au Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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