MCP960X datasheet(51/57 Pages) MICROCHIP

No de pièce	MCP960X

Description	Thermocouple EMF to Temperature Converter, ±1.5°C Maximum Accuracy

PDF	57 Pages

Scroll/Zoom	100%

Fabricant	MICROCHIP [Microchip Technology]

Site Internet	http://www.microchip.com

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51 / 57 page

 2015-2021 Microchip Technology Inc.

DS20005426G-page 51

MCP960X/L0X/RL0X

RECOMMENDED LAND PATTERN

Microchip Technology Drawing C04-186B

20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body

SILK SCREEN

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

3.35

MILLIMETERS

0.65 BSC

MIN

MAX

4.50

Contact Pad Length (X20)

Contact Pad Width (X20)

0.55

0.40

Distance Between Pads

0.20

NOM

[MQFN] - (Also called VQFN)

ØV

MCP960X Fiches technique(PDF) 51 Page - Microchip Technology