MCP960X datasheet(50/57 Pages) MICROCHIP

No de pièce	MCP960X

Description	Thermocouple EMF to Temperature Converter, ±1.5°C Maximum Accuracy

PDF	57 Pages

Scroll/Zoom	100%

Fabricant	MICROCHIP [Microchip Technology]

Site Internet	http://www.microchip.com

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50 / 57 page

 2015-2021 Microchip Technology Inc.

DS20005426G-page 50

MCP960X/L0X/RL0X

Microchip Technology Drawing C04-186B Sheet 2 of 2

Number of Pins

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

0.20 REF

0.35

0.25

0.90

0.00

0.30

0.40

0.95

0.02

MILLIMETERS

MIN

NOM

0.45

0.35

1.00

0.05

MAX

K-

0.20

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Terminal-to-Exposed-Pad

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Length

Exposed Pad Length

3.15

5.00 BSC

3.25

3.35

20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body

[MQFN] - (Also called VQFN)

3.15

5.00 BSC

3.25

3.35

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