STNRGPF02 datasheet(33/43 Pages) STMICROELECTRONICS

No de pièce	STNRGPF02

Description	2-channel interleaved PFC driver with embedded digital inrush current limiter function

PDF	43 Pages

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Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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Thermal data

The STNRGPFx2 functionality cannot be guaranteed when the device, in operation, exceeds the maximum chip

junction temperature (TJmax).

Equation 2

TJmax = TAmax + (PDmax x ΘJA)

Where:

TAmax is the maximum ambient temperature in °C

ΘJA is the package junction to ambient thermal resistance in °C/W

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

PINTmax is the product of IDD and VDD, expressed in watts. This is the maximum chip internal power.

PI/Omax represents the maximum power dissipation on output pins where:

PI/Omax = (VOL x IOL) + ∑ [(VDD - VOH) x IOH],

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at the low and high level.

Table 17. Package thermal characteristics

Symbol

Package thermal characteristics

Value

Unit

TSSOP38 - thermal resistance junction to ambient (1)

°C/W

1. Thermal resistance is based on the JEDEC JESD51-2 with the 4-layer PCB in natural convection

STNRGPF02, STNRGPF12

Thermal data

DS12895 - Rev 2

page 33/43

STNRGPF02 Fiches technique(PDF) 33 Page - STMicroelectronics