5

TL331, TL331B, TL391B

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SLVS238H – AUGUST 1999 – REVISED MAY 2020

Product Folder Links: TL331 TL331B TL391B

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Copyright © 1999–2020, Texas Instruments Incorporated

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.4 ESD Ratings, TL331B and TL391B

VALUE

UNIT

Electrostatic discharge

±2000

V

±750

6.5 Recommended Operating Conditions, TL331 and TL331K

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2

36

V

Junction temperature, TL331

–40

85

°C

Junction temperature, TL331K

–40

105

°C

6.6 Recommended Operating Conditions, TL331B and TL391B

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

3

36

V

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.7 Thermal Information

TL331,

TL331K

TL331B,

TL391B

UNIT

DBV (SOT-23) DBV (SOT-23)

5 PINS

5 PINS

Junction-to-ambient thermal resistance

218.3

211.7

°C/W

Junction-to-case (top) thermal resistance

87.3

133.6

°C/W

Junction-to-board thermal resistance

44.9

79.9

°C/W

Junction-to-top characterization parameter

4.3

56.4

°C/W

Junction-to-board characterization parameter

44.1

79.6

°C/W