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LPC802 Fiches technique(PDF) 73 Page - NXP Semiconductors |
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LPC802 Fiches technique(HTML) 73 Page - NXP Semiconductors |
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73 / 83 page ![]() LPC802 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved. Product data sheet Rev. 1.6 — 27 April 2018 73 of 83 NXP Semiconductors LPC802 32-bit ARM Cortex-M0+ microcontroller Fig 40. Reflow soldering of the TSSOP16 package DIMENSIONS in mm Ay By D1 D2 Gy Hy P1 C Gx sot403-1_fr Hx SOT403-1 solder land occupied area Footprint information for reflow soldering of TSSOP16 package Ay By Gy C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D1 D2 (4x) P2 7.200 4.500 1.350 0.400 0.600 5.600 5.300 7.450 5.800 0.650 0.750 |
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