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BGS8L5 Fiches technique(PDF) 10 Page - NXP Semiconductors |
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BGS8L5 Fiches technique(HTML) 10 Page - NXP Semiconductors |
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10 / 15 page ![]() NXP Semiconductors BGS8L5 SiGe:C low-noise amplifier MMIC with bypass switch for LTE BGS8L5 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 1 — 2 March 2018 10 / 15 13 Application information 13.1 LTE LNA aaa-006409 6 L1 2 1 4 3 RFout RFin VCTRL Vcc C1 5 IC1 For a list of components, see Table 10. Both ground pins must be connected on PCB. Figure 3. Schematics LTE LNA evaluation board Table 10. List of components For schematics, see Figure 3 Component Description Value Remarks C1 decoupling capacitor 1 μF The total capacitance on the VCC node must be at least 1 μF. It must be positioned at a short distance from the VCC pin (preferably within 15 mm). Typically, such capacitance is already present at the output of the VCC voltage regulator. IC1 BGS8L5 NXP 15 nH 617 < f < 652 MHz Murata LQW15A L1 high-quality matching inductor 8.7 nH 703 < f < 960 MHz Murata LQW15A |
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