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LTM4633 Fiches technique(PDF) 19 Page - Linear Technology |
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LTM4633 Fiches technique(HTML) 19 Page - Linear Technology |
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19 / 32 page ![]() LTM4633 19 4633f For more information www.linear.com/LTM4633 applicaTions inForMaTion defined chamber. This θJB + θBA value should accurately equal the θJAvaluebecauseapproximately100%ofpower loss flows from the junction through the board into ambi- ent with no air-flow or top mounted heat sink. LTM4633 Thermal Considerations and Output Current Derating The power loss curves at 5V input, 8V input, and 12V input are in Figures 7 to 9. These power loss curves can be used in coordination with the load current derating curves in Figures 10 to 15 for calculating an approximate θJA thermal resistance for the LTM4633 with various heat sinking and airflow conditions. The power loss curves are taken at room temperature, and are increased with a multiplicative factor of 1.4 at 125°C junction. This factor comes from the fact that the power loss of the regulator increases about 50% from 25°C to 150°C, thus a 50% spread over 125°C delta equates to ~0.4%/°C power loss increase. A 125°C maximum junction minus 25°C room temperature equates to a 100°C increase. This 100°C increase multiplied by 0.4%/°C equals a 40% power loss increase at the 125°C junction, thus the 1.4 multiplier. The derating curves are plotted with the output current starting at 30A and the ambient temperature at 40°C. The 30A come from each of the three channels operating at 10A each. This simplifies the loading for this thermal testing. The output voltages are 1.0V and 1.8V when all three channels are loaded together in parallel. Channel 1 and Channel 2 are designed to operate with outputs up to 1.8V. Two additional derating curves are shown with Channel 1 and Channel 2 operating at 1.8V at 10A each for a total of 20A while Channel 3 is at 5V with 10A load current derated over ambient temperature. This is done to look at some of the different output power conditions to correlate thermal resistance numbers that can be used for derating the LTM4633 power module with different output power requirements. The power loss curve values at a particular output voltage and output current for each output are taken and multiplied by 1.4 for increased power loss at 125°C junction. Thermal models are derived from several temperature measurements in a controlled tem- perature chamber along with thermal modeling analysis. The junction temperatures are monitored while ambient temperature is increased with and without airflow. The power loss increase with ambient temperature change is factored into the derating curves. The junctions are maintained at 125°C maximum while lowering output current or power with increasing ambient temperature. The decreased output current will decrease the internal module loss as ambient temperature is increased. The monitored junction temperature of 125°C minus the ambi- entoperatingtemperaturespecifieshowmuchtemperature rise can be allowed. For example, in Figure 11, the 1V load current is derated to ~20A at ~85°C with no air and with heat sink. In Figure 9, the 12V to 1.0V power loss at 6.66A per channel is 1.4W. The total power loss would be 3 times 1.4W or 4.2W. The 4.2W is then multiplied by the 1.4 multiplier for 125°C junction. This 5.88W value is used with the total temperature rise of 125°C minus the 85°C ambient to calculate θJA thermal resistance. If the 85°C ambient temperature is subtracted from the 125°C junction temperature, then the difference of 40°C divided by 5.88W equals a 6.8°C/W θJA thermal resistance. Table 2 specifies a 6°C/W value which is very close. Tables 2 to 4 provide equivalent thermal resistances for 1.0V, 1.8V, and combination 1.8V and 5V outputs with and without air flow and heat sinking. The derived thermal resistances in Tables 2 and 4 for the various conditions can be multiplied by the calculated power loss as a function of the 125°C maximum junction temperature to determine if the tem- perature rise plus ambient is below the 125°C maximum junction temperature. Thermal or infrared imaging should be performed to validate the calculated results. Room temperature power loss can be derived from the power |
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