MB9BF412RPMC-G-JNE2 datasheet(47/112 Pages) CYPRESS

47 / 112 page

Document Number: 002-05615 Rev. *D

Page

47 of 112

MB9B410R Series

Storage of Semiconductor Devices

Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption

of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel,

reducing moisture resistance and causing packages to crack. To prevent, do the following:

Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in

locations where temperature changes are slight.

Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C

and 30°C.

When you open Dry Package that recommends humidity 40% to 70% relative humidity.

When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica

gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.

Avoid storing packages where they are exposed to corrosive gases or high levels of dust.

Baking

Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended

conditions for baking.

Condition: 125°C/24 h

Static Electricity

Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following

precautions:

Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be

needed to remove electricity.

Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.

Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1

MΩ).

Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is

recommended.

Ground all fixtures and instruments, or protect with anti-static measures.

Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.

MB9BF412RPMC-G-JNE2 Fiches technique(PDF) 47 Page - Cypress Semiconductor