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STW4510 Fiches technique(PDF) 52 Page - STMicroelectronics |
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STW4510 Fiches technique(HTML) 52 Page - STMicroelectronics |
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52 / 57 page ![]() Obsolete Product(s) - Obsolete Product(s) Package mechanical data STw4510 52/57 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7.1 TFBGA 84 balls 6 mm x 6 mm x 1.2 mm See Figure 10: TFBGA84 6 mm x 6 mm x 1.2 mm outline drawing. Table 32. TFBGA84 6 mm x 6 mm x 1.2 mm - 0.5mm ball pitch (1) (2) 1. These measurements conform to JEDEC standards 2. Drawing dimensions Parameter Min. Typ. Max. Unit A 1.16 mm A1 0.20 0.25 0.30 mm A2 0.82 mm b 0.25 0.30 0.35 mm D 5.90 6.00 6.10 mm D1 4.50 mm E 5.90 6.00 6.10 mm E1 4.50 mm e 0.45 0.50 0.55 mm f 0.65 0.75 0.85 mm ddd 0.08 mm |
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