PCA2000 datasheet(15/19 Pages) PHILIPS

15 / 19 page

2003 Dec 17

Philips Semiconductors

Product speciﬁcation

32 kHz watch circuit with programmable

adaptive motor pulse

PCA2000; PCA2001

BONDING PAD LOCATIONS

Notes

1. All coordinates are referenced, in

µm, to the centre of

the die (see Fig.13).

2. Pad TEST is used for factory tests; in normal operation

it should be left open-circuit, and it has an internal

pull-down resistance to VSS.

3. The substrate (rear side of the chip) is connected to

VSS. Therefore the die pad must be either floating or

connected to VSS.

Table 7

Mechanical chip data; note 1

Note

1. The substrate of the chip is connected to VSS.

SYMBOL

PAD

COORDINATES(1)

VSS(3)

−480

+330

TEST(2)

−480

+160

OSCIN

−480

−160

OSCOUT

−480

−330

VDD

+480

−330

MOT1

+480

−160

MOT2

+480

+160

RESET

+480

+330

handbook, halfpage

MGW353

0.90 mm

VDD

MOT2

MOT1

RESET

VSS

TEST

OSCIN

OSCOUT

1.20 mm

Fig.13 Bonding pad locations.

PARAMETER

VALUE

Bonding pad:

metal

× 96 µm

opening

× 86 µm

Thickness:

chip for bonding

200

±25 µm

chip for golden bumps

270

±25 µm

Bumps:

height

±5 µm

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