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ECMF04-4HSM10 Fiches technique(PDF) 10 Page - STMicroelectronics |
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ECMF04-4HSM10 Fiches technique(HTML) 10 Page - STMicroelectronics |
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10 / 13 page ![]() Package information ECMF04-4HSM10 10/13 DocID024844 Rev 2 4 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 18. µQFN-10L dimension definitions Table 4. µQFN-10L dimension values Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 2.55 2.60 2.65 0.1 0.102 0.104 E 1.30 1.35 1.40 0.051 0.053 0.055 e 0.50 0.020 L 0.40 0.50 0.60 0.016 0.020 0.024 D Idex area Top view Side view Bottom view E A e L b A1 PIN # 1 ID 1 10 5 6 |
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