TLV2553_15 datasheet(29/36 Pages) TI1

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TLV2553

www.ti.com

SLAS354C – SEPTEMBER 2001 – REVISED SEPTEMBER 2015

10 Power Supply Recommendations

The TLV2553 is designed to operate from a single power supply voltage from 2.7 V ti 5.5 V. The ADC supply

voltage must be well-regulated. A 1-

μF ceramic decoupling capacitor is required and must be placed as close as

possible to the device to minimize inductance along the load current path.

Many modern microcontrollers have interfaces that support only up to 3.3-V logic levels, which is incompatible

with the TLV2553 when the device is operated on a 5-V power supply. In such cases, 5-V to 3.3-V digital level

translators may be used to facilitate communication between the TLV2553 and the microcontroller host.

11 Layout

11.1 Layout Guidelines

•

All decoupling capacitors must be located as close as possible to the loads they are supplying.

•

TI recommends large copper fill areas or thick traces wherever possible to provide low inductance current

paths between decoupling capacitors and their loads

•

Ensure that there are no vias or discontinuities in the forward or return current paths that can cause the

current loop area and therefore the loop inductance to increase.

•

For high-frequency current paths routed across PCB layers, multiple vias can be placed close together (but

not obstructing the current path) to lower inductance.

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