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M35B32 Fiches technique(PDF) 41 Page - STMicroelectronics |
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M35B32 Fiches technique(HTML) 41 Page - STMicroelectronics |
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41 / 44 page ![]() DocID18391 Rev 4 41/44 M35B32 Package mechanical data 43 e - 0.500 - 0.0197 K 0.300 - - 0.0118 - - L 0.300 - 0.500 0.0118 - 0.0197 L1 - - 0.150 - - 0.0059 L3 0.300 - - 0.0118 - - aaa - - 0.150 - - 0.0059 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee(3) - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 3. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from mea- suring. Table 14. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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