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M35B32 Fiches technique(PDF) 40 Page - STMicroelectronics |
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M35B32 Fiches technique(HTML) 40 Page - STMicroelectronics |
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40 / 44 page ![]() Package mechanical data M35B32 40/44 DocID18391 Rev 4 11.3 UFDFN8 package information Figure 25. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package outline 1. Max. package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. Table 14. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.450 0.550 0.600 0.0177 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 b(2) 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 1.900 2.000 2.100 0.0748 0.0787 0.0827 D2 1.200 - 1.600 0.0472 - 0.0630 E 2.900 3.000 3.100 0.1142 0.1181 0.1220 E2 1.200 - 1.600 0.0472 - 0.0630 |
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