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AN4630 Fiches technique(PDF) 23 Page - STMicroelectronics

No de pièce AN4630
Description  PCB design guidelines for the BlueNRG and BlueNRG-MS devices
PDF  33 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN4630 Fiches technique(HTML) 23 Page - STMicroelectronics

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AN4630
Design recommendations when using
WLCSP34 package
Figure 18: WLCSP34 ground connection (TOP layer view)
In the INNER2 layer, Figure 19: "WLCSP34 ground connection (INNER2 layer view)",
buried filled vias have to be used to connect INNER2 layer ground and INNER 3 layer
ground. The buried filled vias have to be put with 400 um of offset (both in x and y
directions) respect to laser vias.
In the INNER2 layer the GND_SMPS has to be kept separated from the GND.
It is necessary not put ground layer under the RF discrete balun. This is because due to the
very little distance between TOP and INNER2 layers; 80 um, the parasitic capacitances
would be too big and would not be possible to find a working solution of the matching
network.
DocID027262 Rev 1
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