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ML22804 Fiches technique(PDF) 39 Page - List of Unclassifed Manufacturers

No de pièce ML22804
Description  LAPIS Semiconductor ADPCM Algorithm-Based Speech Synthesis LSI
PDF  41 Pages
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Fabricant  ETC2 [List of Unclassifed Manufacturers]
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ML22804 Fiches technique(HTML) 39 Page - List of Unclassifed Manufacturers

Back Button ML22804 Datasheet HTML 33Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 34Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 35Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 36Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 37Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 38Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 39Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 40Page - List of Unclassifed Manufacturers ML22804 Datasheet HTML 41Page - List of Unclassifed Manufacturers  
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FEDL2280XFULL-04
ML22808/ML22804/Ml22802-XXX
PACKAGE DIMENSIONS
(Unit: mm)
SSOP30-P-56-0.65-K
Mirror finish
Package material
Epoxy resin
Lead frame material
42 alloy
Pin treatment
Solder plating (
≥5μm)
Package weight (g)
0.19 TYP.
5
Rev. No./Last Revised
5/Dec. 5, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
39/41



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