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ZIOL2102 Fiches technique(PDF) 71 Page - List of Unclassifed Manufacturers

No de pièce ZIOL2102
Description  IO-Link compliant HV Line Driver IC Family
PDF  91 Pages
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Fabricant  ETC2 [List of Unclassifed Manufacturers]
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ZIOL2102 Fiches technique(HTML) 71 Page - List of Unclassifed Manufacturers

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ZIOL2xxx – IC Family
IO-Link compliant HV Line Driver IC Family
Data Sheet
January 31, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 2.2.1
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to
changes without notice.
71 of 90
Figure 6.1 Pin Diagram of the ZIOL2xxx
6.3. Optimal PCB Layout
In order to obtain optimal heat distribution (minimized thermal resistance between package and board) certain
PCB layout rules shall be applied. Those rules are described in the application note for the used QFN package
(refer to chapter 8, [4]). Crucial for optimal heat distribution is the correct number, diameter and placement of via’s
underneath the exposed die paddle as described in the above mentioned application note.



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