MPC8280EC datasheet(15/83 Pages) FREESCALE

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MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2

Freescale Semiconductor

Power Dissipation

This table provides preliminary, estimated power dissipation for various configurations. Note that suitable

thermal management is required to ensure the junction temperature does not exceed the maximum

specified value. Also note that the I/O power should be included when determining whether to use a heat

sink. For a complete list of possible clock configurations, see Section 7, “Clock Configuration Modes.”

Table 7. Estimated Power Dissipation for Various Configurations1

1 Test temperature = 105° C

Bus

(MHz)

CPM

Multiplication

Factor

CPM

(MHz)

CPU

Multiplication

Factor

CPU

(MHz)

PINT(W)

2,3

2 P

INT = IDD x VDD Watts

3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:

66.7 MHz = 0.45 W (nominal), 0.5 W (maximum)

83.3 MHz = 0.5W (nominal), 0.6 W (maximum)

100 MHz = 0.6 W (nominal), 0.7 W (maximum)

Vddl 1.5 Volts

Nominal

Maximum

66.67

2.5

166

3.5

233

0.95

1.0

66.67

2.5

166

266

1.0

1.05

66.67

200

266

1.05

1.1

66.67

3.5

233

4.5

300

1.05

1.15

83.33

250

333

1.25

1.35

83.33

250

4.5

375

1.3

1.4

83.33

3.5

292

417

1.45

1.55

100

300

400

1.5

1.6

100

300

4.5

450

1.55

1.65

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