Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • http://www.vectron.com

Environmental and IR Compliance

Table 4. Environmental Compliance

Parameter

Condition

Mechanical Shock

MIL-STD-883 Method 2002

Mechanical Vibration

MIL-STD-883 Method 2007

Temperature Cycle

MIL-STD-883 Method 1010

Solderability

MIL-STD-883 Method 2003

Fine and Gross Leak

Fine and Gross Leak

MIL-STD-883 Method 1014

Resistance to Solvents

MIL-STD-883 Method 2015

Moisture Sensitivity Level

Moisture Sensitivity Level

MSL1

Contact Pads

Gold over Nickel

Gold thickness is 0.3-1.0um

100

LVDS

Driver

LVDS

Receiver

100

LVDS

Driver

Receiver

Figure 6. LVDS to LVDS Connection, Internal 100ohm Resistor

Some LVDS structures have an internal 100 ohm resistor on the in-

put and do not need additional components. AC blocking capacitors

can be used if the DC levels are incompatible.

Figure 7. LVDS to LVDS Connection

Some input structures may not have an internal 100 ohm resis-

tor on the input and will need an external 100ohm resistor for

impedance matching. Also, the input may have an internal DC

bias which may not be compatible with LVDS levels, AC block-

ing capacitors can be used.

LVDS Application Diagrams

One of the most important considerations is terminating the Output and Complementary Outputs equally. An unused output should not be left un-termi-

nated, and if it one of the two outputs is left open it will result in excessive jitter on both. PC board layout must take this and 50 ohm impedance matching

into account. Load matching and power supply noise are the main contributors to jitter related problems.

IR Compliance

Table 5. Reflow Profile

Parameter

Symbol

Value

PreHeat Time

ts

200 sec Max

Ramp Up

R

UP

3°C/sec Max

Time above 217°C

tL

150 sec Max

Time to Peak Temperature

tAMB-P

480 sec Max

Time at 260°C

Time at 260°C

tP

30 sec Max

Time at 240°C

tP2

60 sec Max

Ramp down

Ramp down

R

DN

6°C/sec Max

Suggested IR Profile

Devices are built using lead free epoxy and can be subjected to

standard lead free IR reflow conditions shown in Table 5. Contact

pads are gold over nickel and lower maximum temperatures can also

be used, such as 220C.

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