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DSPIC30F2010 Fiches technique(PDF) 185 Page - Microchip Technology |
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DSPIC30F2010 Fiches technique(HTML) 185 Page - Microchip Technology |
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185 / 202 page ![]() © 2011 Microchip Technology Inc. DS70118J-page 185 dsPIC30F2010 23.0 PACKAGING INFORMATION 23.1 Package Marking Information 28-Lead SOIC (7.5 mm) XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example dsPIC30F2010-30I/SO 0648017 28-Lead SPDIP (Skinny DIP) XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example dsPIC30F2010-30I/SP 0648017 XXXXXXXX 28-Lead QFN-S XXXXXXXX YYWWNNN dsPIC30F2010 Example -30I/MM 060700U Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e |
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