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PCA2000UAC Fiches technique(PDF) 21 Page - NXP Semiconductors |
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PCA2000UAC Fiches technique(HTML) 21 Page - NXP Semiconductors |
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21 / 30 page ![]() PCA2000_2001 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 23 August 2010 21 of 30 NXP Semiconductors PCA2000; PCA2001 32 kHz watch circuit with programmable adaptive motor pulse [1] All coordinates are referenced, in μm, to the center of the die (see Figure 2, Figure 13 and Figure 14). [2] The substrate (rear side of the chip) is connected to VSS. Therefore the die pad must be either floating or connected to VSS. [3] Pad i.c. is used for factory tests; in normal operation it should be left open-circuit, and it has an internal pull-down resistance to VSS. 12. Packing information 12.1 Tray information Table 13. Bonding pad and solder bump locations Symbol Pad Coordinates[1] x y VSS[2] 1 −480 +330 i.c.[3] 2 −480 +160 OSCIN 3 −480 −160 OSCOUT 4 −480 −330 VDD 5+480 −330 MOT1 6 +480 −160 MOT2 7 +480 +160 RESET 8 +480 +330 Fig 15. Tray details mgu653 D F E x y A G H 1,1 x,1 2,1 1,2 1,3 1,y x,y 2,2 3,1 C B M J A A SECTION A-A |
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