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PCA2000UAC Fiches technique(PDF) 2 Page - NXP Semiconductors

No de pièce PCA2000UAC
Description  32 kHz watch circuit with programmable adaptive motor pulse
PDF  30 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCA2000UAC Fiches technique(HTML) 2 Page - NXP Semiconductors

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PCA2000_2001
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 08 — 23 August 2010
2 of 30
NXP Semiconductors
PCA2000; PCA2001
32 kHz watch circuit with programmable adaptive motor pulse
End Of Life (EOL) indication for silver oxide or lithium battery (only the PCA2000 has
the EOL feature)
Test mode for accelerated testing of the mechanical parts of the watch and the IC
Test bits for type recognition
3.
Applications
Driver circuits for bipolar stepping motors
High immunity motor drive circuits
4.
Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Delivery form
Version
PCA2000U/AC/1
PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip in tray
PCA200xU
PCA2001U/AC/1
PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip in tray
PCA200xU
PCA2000U/10AC/1 PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip on film frame carrier
PCA200xU
PCA2001U/10AC/1 PCA200xU
wire bond die; 8 bonding pads;
1.16
× 0.86 × 0.22 mm
chip on film frame carrier
PCA200xU
PCA2000CX8/5/1
PCA200xCX
wafer level chip-size package;
8 bumps
unsawn wafer with lead free
solder bumps
PCA200xCX
PCA2001CX8/5/1
PCA200xCX
wafer level chip-size package;
8 bumps
unsawn wafer with lead free
solder bumps
PCA200xCX
PCA2000CX8/12/1 PCA200xCX
wafer level chip-size package;
8 bumps
sawn wafer with lead free
solder bumps on Film Frame
Carrier (FFC)
PCA200xCX



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