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P89LPC9331FDH Fiches technique(PDF) 88 Page - NXP Semiconductors |
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P89LPC9331FDH Fiches technique(HTML) 88 Page - NXP Semiconductors |
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88 / 93 page ![]() P89LPC9331_9341_9351_9361_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 2 June 2009 88 of 93 NXP Semiconductors P89LPC9331/9341/9351/9361 8-bit microcontroller with accelerated two-clock 80C51 core Fig 51. TSSOP package outline (SOT361-1) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 9.8 9.6 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.8 0.5 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT361-1 MO-153 99-12-27 03-02-19 0.25 w M b p Z e 114 28 15 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A D y 0 2.5 5 mm scale TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 A max. 1.1 |
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