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P89LPC915FDH Fiches technique(PDF) 68 Page - NXP Semiconductors |
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P89LPC915FDH Fiches technique(HTML) 68 Page - NXP Semiconductors |
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68 / 75 page ![]() P89LPC915_916_917_5 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 05 — 15 December 2009 68 of 75 NXP Semiconductors P89LPC915/916/917 8-bit microcontrollers with accelerated two-clock 80C51 core 14. Package outline Fig 30. Package outline SOT27-1 (DIP14) UNIT A max. 1 2 (1) (1) b1 cD (1) Z Ee MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT27-1 99-12-27 03-02-13 A min. A max. b max. w M E e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.087 0.17 0.02 0.13 050G04 MO-001 SC-501-14 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 14 1 8 7 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 |
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