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LSM320HAY30TR Fiches technique(PDF) 39 Page - STMicroelectronics |
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LSM320HAY30TR Fiches technique(HTML) 39 Page - STMicroelectronics |
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39 / 42 page ![]() LSM320HAY30 Package information Doc ID 16917 Rev 1 39/42 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 11. LGA-28: mechanical data and package dimensions Dim. mm Min. Typ. Max. A1 1.1 A2 0.855 A3 0.2 D1 4.25 4.4 4.55 E1 7.25 7.5 7.55 N1 0.3 L1 5.4 L2 1.8 P2 1.2 T1 0.6 T2 0.4 M 0.1 d 0.3 k 0.05 h 0.1 LGA-28L (4.4x7.5x1.1mm) Land Grid Array Package Outline and 8190050A E1 A1 L1 T2 T1 B E D A k k D k E K h C C Pin 1 Indicator TOP VIEW Seating Plane N1 == A3 A2 k mechanical data |
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