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TS4601B Fiches technique(PDF) 25 Page - STMicroelectronics

No de pièce TS4601B
Description  High performance stereo headphone amplifier with capacitorless outputs and I2C bus interface
PDF  28 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TS4601B Fiches technique(HTML) 25 Page - STMicroelectronics

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TS4601B
Package information
25/28
5
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 53.
TS4601B footprint recommendation
Figure 54.
Pinout
150
μm min.
500
μm
500
μm
Φ=250μm
Φ=400μm typ.
75µm min.
100
μm max.
Track
Non Solder mask opening
Φ=340μm min.
Pad in Cu 18
μm with Flash NiAu (2-6μm, 0.2μm max.)
150
μm min.
500
μm
500
μm
Φ=250μm
Φ=400μm typ.
75µm min.
100
μm max.
Track
Non Solder mask opening
Φ=340μm min.
Pad in Cu 18
μm with Flash NiAu (2-6μm, 0.2μm max.)
Balls are underneath
Top view
Bottom view
C1
C2
PVCC
VCC
GND
PVSS
CMS
VOUTR
VOUTL
INL+
INR+
INL-
INR-
SCL
SDA
SDZ
432
1
A
B
C
D
C1
C2
PVCC
VCC
GND
PVSS
CMS
VOUTR
VOUTL
INL+
INR+
INL-
INR-
SCL
SDA
SDZ
432
1
A
B
C
D
C1
C2
PVCC
VCC
GND
PVSS
CMS
VOUTR
VOUTL
INL+
INR+
INL-
INR-
SCL
SDA
SDZ
123
4
A
B
C
D
C1
C2
PVCC
VCC
GND
PVSS
CMS
VOUTR
VOUTL
INL+
INR+
INL-
INR-
SCL
SDA
SDZ
123
4
A
B
C
D



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