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MPC8309CVMADDC Fiches technique(PDF) 39 Page - NXP Semiconductors

No de pièce MPC8309CVMADDC
Description  PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications
PDF  81 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
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MPC8309CVMADDC Fiches technique(HTML) 39 Page - NXP Semiconductors

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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
39
eSDHC
14 eSDHC
This section describes the DC and AC electrical specifications for the eSDHC interface of the device.
14.1
eSDHC DC Electrical Characteristics
The following table provides the DC electrical characteristics for the eSDHC interface.
14.2
eSDHC AC Timing Specifications
The following table provides the eSDHC AC timing specifications as defined in Figure 30 and Figure 31.
Table 39. eSDHC Interface DC Electrical Characteristics
At recommended operating conditions with OVDD =3.3 V
Characteristic
Symbol
Condition
Min
Max
Unit
Note
Input high voltage
VIH
—0.625
 OVDD
—V
1
Input low voltage
VIL
0.25
 OVDD
V1
Output high voltage
VOH
IOH = –100 A at
OVDD min
0.75
 OVDD
—V
Output low voltage
VOL
IOL =100 A at
OVDD min
—0.125
 OVDD
V—
Output high voltage
VOH
IOH = –100 mA
OVDD –0.2
V
2
Output low voltage
VOL
IOL =2mA
0.3
V
2
Input/output leakage current
IIN/IOZ
—–10
10
A—
Notes:
1. Note that the min VILand max VIH values are based on the respective min and max OVIN values found in Table 2..
2. Open drain mode for MMC cards only.
Table 40. eSDHC AC Timing Specifications
At recommended operating conditions with OVDD =3.3 V
Parameter
Symbol1
Min
Max
Unit
Notes
SD_CLK clock frequency:
SD/SDIO Full-speed/High-speed mode
MMC Full-speed/High-speed mode
fSHSCK
0
25/33.25
20/52
MHz
2, 4
SD_CLK clock low time—Full-speed/High-speed mode
tSHSCKL
10/7
ns
4
SD_CLK clock high time—Full-speed/High-speed mode
tSHSCKH
10/7
ns
4
SD_CLK clock rise and fall times
tSHSCKR/
tSHSCKF
—3
ns
4
Input setup times: SD_CMD, SD_DATx, SD_CD to
SD_CLK
tSHSIVKH
5—
ns
4



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