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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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VS6624P0LP Fiches technique(PDF) 101 Page - STMicroelectronics |
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VS6624P0LP Fiches technique(HTML) 101 Page - STMicroelectronics |
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101 / 106 page  VL6624/VS6624 Package mechanical data 101/106 15.2 LGA In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 52. LGA package mechanical data Data book (mm) Symbol Min. Typ. Max. A 1.80 1.90 2.00 A4 0.35 0.4 0.45 A5 0.7 0.8 0.9 B1 2.0 B2 3.5 B3 0.55 b 0.25 0.30 0.35 D 9.90 10.00 10.10 D1 9.60 9.70 9.80 D2 5 D4 5.4 e0.8 E 9.90 10.00 10.10 E1 9.60 9.70 9.80 E2 5 E4 4.5 G 1.0 1.1 1.2 G1 1 G2 0.3 0.4 0.5 G3 0.8 0.9 1.0 G4 0.8 H 0.8 0.9 1.0 H1 0.8 H2 0.3 0.4 0.5 I 3.95 4.05 4.15 J4.1 K0.3 |
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