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TPS799 Fiches technique(PDF) 40 Page - Texas Instruments |
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TPS799 Fiches technique(HTML) 40 Page - Texas Instruments |
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40 / 49 page ![]() www.ti.com PACKAGE OUTLINE C 6X 0.35 0.25 1.6 0.1 6X 0.3 0.2 2X 1.3 1 0.1 4X 0.65 0.8 0.7 0.05 0.00 B 2.1 1.9 A 2.1 1.9 (0.2) TYP WSON - 0.8 mm max height DRV0006D PLASTIC SMALL OUTLINE - NO LEAD 4225563/A 12/2019 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 3 4 6 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED 7 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 |
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