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SPC563M60L7 Fiches technique(PDF) 89 Page - STMicroelectronics

No de pièce SPC563M60L7
Description  32-bit Power Architecture based MCU for automotive powertrain applications
PDF  128 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC563M60L7 Fiches technique(HTML) 89 Page - STMicroelectronics

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SPC563M64x, SPC563M60x
Electrical characteristics
127
4.9.2
LVDS pad specifications
LVDS pads are implemented to support the MSC (Microsecond Channel) protocol which is
an enhanced feature of the DSPI module. The LVDS pads are compliant with LVDS
specifications and support data rates up to 50 MHz.
MultiV(3) (High
Swing Mode)
IDRV_MULTV_HV
CC
D
40
50
11
2.75
258
CC
D
100
50
01
0.11
76.5
CC
D
500
50
00
0.02
56.2
CC
D
500
200
00
0.01
56.2
MultiV(4) (Low
Swing Mode)
IDRV_MULTV_HV
CC
D
40
30
11
2.75
258
CC
D
100
30
11
0.11
76.5
CC
D
500
30
11
0.02
56.2
CC
D
500
30
11
0.01
56.2
1.
These are typical values that are estimated from simulation and not tested. Currents apply to output pins only.
2.
All loads are lumped.
3.
Average current is for pad configured as output only.
4.
In low swing mode, multi-voltage pads (pad_multv_hv) must operate in highest slew rate setting.
Table 25. I/O pad VRC33 average IDDE specifications
(1) (continued)
Pad Type
Symbol
C
Period
(ns)
Load(2)
(pF)
Slew Rate
Select
IDD33 Avg
(µA)
IDD33 RMS
(µA)
Table 26. VRC33 pad average DC current
(1)
1.
These are typical values that are estimated from simulation and not tested. Currents apply to output pins
only.
Pad
Type
Symbol
C
Period
(ns)
Load(2)
(pF)
2.
All loads are lumped.
VRC33
(V)
VDDE
(V)
Drive
Select
IDD33 Avg
(µA)
IDD33 RMS
(µA)
Fast
IDRV_FC
CC
D
10
50
3.6
3.6
11
2.35
6.12
CC
D
10
30
3.6
3.6
10
1.75
4.3
CC
D
10
20
3.6
3.6
01
1.41
3.43
CC
D
10
10
3.6
3.6
00
1.06
2.9
CC
D
10
50
3.6
1.98
11
1.75
4.56
CC
D
10
30
3.6
1.98
10
1.32
3.44
CC
D
10
20
3.6
1.98
01
1.14
2.95
CC
D
10
10
3.6
1.98
00
0.95
2.62



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