| Moteur de recherche de fiches techniques de composants électroniques |
|
LM393DGKR.A Fiches technique(PDF) 47 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
LM393DGKR.A Fiches technique(HTML) 47 Page - Texas Instruments |
|
47 / 56 page ![]() www.ti.com PACKAGE OUTLINE C 8X 0.32 0.18 1.6 0.1 2X 1.5 0.9 0.1 6X 0.5 8X 0.4 0.2 0.05 0.00 0.8 0.7 A 2.1 1.9 B 2.1 1.9 0.32 0.18 0.4 0.2 (DIM A) TYP WSON - 0.8 mm max height DSG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218900/E 08/2022 SIDE WALL METAL THICKNESS DIM A OPTION 1 OPTION 2 0.1 0.2 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 X 0.25) (45 PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED 9 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 ALTERNATIVE TERMINAL SHAPE TYPICAL |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |