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L9963E Fiches technique(PDF) 11 Page - STMicroelectronics |
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L9963E Fiches technique(HTML) 11 Page - STMicroelectronics |
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11 / 184 page ![]() Symbol Parameter Test conditions Min. Typ. Max. Unit ISENSEP/M - -0.3 - 4.5 V VCOM - -0.3 - 6 V VANA - -0.3 - 4.5 V VREG - -0.3 - 12 V NPNDRV - -0.3 - 12 V CAP1 - -0.3 - VBAT + 0.3V V CAP2 - VREG – 0.3V - VBAT + 7V V DGND, CGND - -0.3 - + 0.3 V GNDREF shorted to AGND - - Table 4. ESD protection Item Parameter Test conditions Min. Typ. Max. Unit All pins Except Isolated Communication Terminals and Global pins(1) - HBM(2) -2 - 2 kV Isolated Communication Terminals(1)(2) and Global pins versus all GND+EP connected -4 - 4 kV All pins except Corner Pins - CDM(3) -500 - 500 V Corner Pins -750 - 750 V All pins - Latch up(4) -100 - 100 mA 1. Tested per AEC-Q100-002. 2. Isolated Communication Terminals: ISOHP, ISOHM, ISOLP_SDI, ISOLM_NCS. 3. Tested per AEC-Q100-011. 4. Tested per AEC-Q100-004, Class-2, Level-A. Pins are all GND connected together. 3.3 Temperature ranges and thermal data Table 5. Temperature ranges and thermal data Symbol Parameter Test conditions Min Max Unit Tamb Operating and testing temperature (ECU environment) - -40 105 °C TJ Junction temperature for all parameters - -40 125 °C Tstg Storage temperature - -65 150 °C Tot Thermal shut-down temperature (junction) - 175 200 °C Tot Temperature ADC accuracy - -10 +10 °C O Thys Thermal shut-down temperature hysteresis - 5 15 °C RThj-amb Thermal resistance junction-to-ambient(1) - 22 °C/W 1. In “2s2p”, the “s” suffix stands for “Signal” and the number before indicates how many PCB layers are dedicated to signal wires. The “p” suffix stands for “Power” and the number before indicates how many PCB layers are dedicated to power planes. L9963E Temperature ranges and thermal data DS13636 - Rev 12 page 11/184 |
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