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CC2640R2FYFVT.B Fiches technique(PDF) 71 Page - Texas Instruments

No de pièce CC2640R2FYFVT.B
Description  CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU
PDF  74 Pages
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Fabricant  TI2 [Texas Instruments]
Site Internet  https://www.ti.com
Logo TI2 - Texas Instruments

CC2640R2FYFVT.B Fiches technique(HTML) 71 Page - Texas Instruments

Back Button CC2640R2FYFVT.B Datasheet HTML 66Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 67Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 68Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 69Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 70Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 71Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 72Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 73Page - Texas Instruments CC2640R2FYFVT.B Datasheet HTML 74Page - Texas Instruments  
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PACKAGE OUTLINE
C
32X
0.3
0.2
3.45 0.1
32X
0.5
0.3
1 MAX
(0.2) TYP
0.05
0.00
28X 0.5
2X
3.5
2X 3.5
A
5.1
4.9
B
5.1
4.9
(0.1)
VQFN - 1 mm max height
RHB0032E
PLASTIC QUAD FLATPACK - NO LEAD
4223442/B 08/2019
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
8
17
24
9
16
32
25
(OPTIONAL)
PIN 1 ID
0.1
C A B
0.05
C
EXPOSED
THERMAL PAD
33
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 3.000
SEE SIDE WALL
DETAIL
20.000
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS



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